DOC CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Materials and Substrates

Institutionally Coordinated // Limit: 1 // L. Folks (Semiconductor Strategy)

Please contact the Center for Semiconductor Manufacturing (CSM)  for more information. 

Eligible applicants can only submit one concept plan paper under this NOFO.

Program Priorities

“Advanced packaging” refers to many chips with diverse functions assembled tightly together on a substrate in two or three dimensions at extremely fine dimensions. This method achieves function, performance, and power savings far greater than can be achieved with conventionally packaged chips on a printed circuit board. Recent advances in artificial intelligence, for example, would not be possible without advanced packaging.

Advanced packaging can be a transformative capability that helps U.S. manufacturers compete globally, but there are many technological challenges to solve. The CHIPS Research and Development Office has established the CHIPS National Advanced Packaging Manufacturing Program to address these challenges, including:

• How do we design and assemble chips so tightly that they behave like a single traditional large chip, but with the production efficiency and cost savings of advanced packaging?

• How do we supply power to and dissipate heat from such tightly coupled assemblies?

• How do we test and repair such complex assemblies?

• How do we ensure their reliability since traditional methods of visual inspection cannot be performed on such small, tightly packaged dimensions?

The CHIPS NAPMP will enable the development of a robust domestic advanced packaging ecosystem by:

• Establishing an advanced packaging piloting facility (or facilities) that accelerates the transfer of innovations in packaging, equipment, and process development into manufacturing;

• Driving the development of digital tools to reduce the time and cost of advanced packaging engineering; and,

• Establishing and supporting partnerships among industry, academia and training entities, and government to contribute to an advanced packaging workforce.

The six priority research investment areas of the CHIPS NAPMP are:

• Materials and substrates

• Equipment, tools, and processes

• Power delivery and thermal management for advanced packaging assemblies

• Photonics and connectors that communicate with the outside world

• A chiplet ecosystem

• Co-design of multi-chiplet systems with automated tools