National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development (R&D)

Institutionally Coordinated Limit: 5* // Available: 5

The submission for this funding program is coordinated by the Center for Semiconductor Manufacturing.Please contact Dan Moseke, Project Director, for more information.

Applications such as high performance computing and lowpower electronics, both needed for artificial intelligence (AI), require leap-ahead advances in semiconductor advanced packaging. This Notice of Funding Opportunity (NOFO) seeks proposals for R&D activities that will establish and accelerate domestic semiconductor advanced packaging through investments in five (5) R&D Areas: (1) Equipment, Tools, Processes, and Process Integration; (2) Power Delivery and Thermal Management; (3) Connector Technology, including Photonics and Radio Frequency (RF); (4) Chiplets Ecosystem; and (5) Co-design/Electronic Design Automation (EDA).

The submission of a concept paper is required. Eligible applicants may submit only one concept paper per R&D Area. Each concept paper may only include one R&D Area. Applicants may submit separate concept papers on different R&D Areas.